High-quality foam pads ideal for Professional applications

• Partially closed cells are strategically patterned to drastically improve polishing performance by evenly dispersing compound/polishing onto the working surface
• Slower rate of polish absorption enhances polishing performance
• Reduced surface tension allows operator to run pad flat on the working surface with greatly minimized pad skipping
• CCS pockets gradually release compound/polish as required, resulting in increased operator control
• Reduced surface contact generates less friction and heat
• Curved edges enable easier polishing in corners and along edges
• Hook and Loop backing
• Machine wash in warm water and air dry to clean
• Available in Hard/Cutting, Medium/Polishing and Soft/Finessing densities